SDM5001 Failure Mechanisms of Polymers in Microelectronic Packages

Course Outline:

To provide the students with a basic understanding of the roles that polymer materials playing in the microelectronic and microsystem packages (e-package) and its importance in product design, the concept of material selection and design, the failure behavors and mechanisms of e-packages due to polymer materials failure, physical and chemical properties of polymer materials.To provide students with basic knowledge on the insutry size of e-package manufacturing and the understanding the controlling factors that dectating the quality of massive production in reality.

 

Instructor

Prof. WU Jingshen, Prof. XUE Ke